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HLMP-HD55, HLMP-HM57, HLMP-HB57
Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs
Data Sheet
Description
These Precision Optical Performance Oval LEDs are specificallydesignedforfullcolor/videoandpassenger informationsigns.Theovalshapedradiationpatternand highluminousintensityensurethesedevicesareexcellent forwidefieldofviewoutdoorapplicationswhereawide viewing angle and readability in sunlight are essential. Theselampshaveverysmooth,matchedradiationpatternsensuringconsistentcolormixinginfullcolorapplications,messageuniformityacrosstheviewingangleofthe sign.HighefficiencyLEDmaterialisusedintheselamps: higherperformanceAluminumIndiumGalliumPhosphide (AlInGaPII)forredcolor,IndiumGalliumNitride(InGaN) forblueandgreen.Eachlampismadewithanadvance opticalgradeepoxyofferingsuperiorhightemperature andhighmoistureresistanceinoutdoorapplications. ThepackageepoxycontainsbothUV-AandUV-Binhibitorstoreducetheeffectsoflongtermexposuretodirect sunlight.
Features
* Welldefinedspatialradiationpattern * Highbrightnessmaterial * Availableinred,greenandbluecolor RedAlInGaP630nm GreenInGaN525nm BlueInGaN470nm * Tintedanddiffused

Benefits
* Viewingangledesignedforwidefieldofviewapplications * Superiorperformanceforoutdoorenvironments
Applications
* Fullcolorsigns * Commercialoutdooradvertising
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
A
11.90 0.50 (0.469 0.019) 1.50 0.15 (0.059 0.006) 0.70 MAX. (0.028) 5.20 0.25 (0.204 0.010) CATHODE LEAD (SEE NOTE A) 0.50 0.10 SQ. TYP. (0.020 0.004) NOTE: MEASURED AT BASE OF LENS. 3.80 0.25 (0.150 0.010)
2.54 0.25 (0.10 0.010)
1.0 MAX. (0.039) 7.00 0.25 (0.275 0.010)
1.00 MIN. (0.039)
24.00 MIN. (0.945)
B
11.80 0.50 (0.465 0.019) 1.50 0.15 (0.059 0.006) 0.70 MAX. (0.028) 5.20 0.50 (0.205 0.020) CATHODE LEAD (SEE NOTE A) 0.50 0.10 SQ. TYP. (0.020 0.004)
2.54 0.25 (0.10 0.010)
1.0 MAX. (0.039) 6.85 0.25 (0.270 0.010)
1.00 MIN. (0.039)
24.00 MIN. (0.945)
NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. FOR InGaN BLUE AND GREEN (PACKAGE B), IF HEAT-SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
Device Selection Guide
Part Number
HLMP-HD55-NR0xx HLMP-HB57-KN0XX HLMP-HB57-LMCxx HLMP-HB57-LP0xx HLMP-HM57-SV0xx HLMP-HM57-RSCxx HLMP-HM57-RU0xx
Color
Red Blue Blue Blue Green Green Green
Typical Dominant Wavelength ld (nm)
630 470 470 470 525 525 525
Luminous Intensity Iv (mcd) at 20 mA Minimum Maximum
680 310 400 400 1900 1500 1500 1900 880 680 1150 5500 2500 4200
Package Lens Type
Tinted,Diffused Tinted,Diffused Tinted,Diffused Tinted,Diffused Tinted,Diffused Tinted,Diffused Tinted,Diffused
Dimension
A B B B B B B
Notes: 1. Toleranceforluminousintensitymeasurementis15%. 2. Theluminousintensityismeasuredonthemechanicalaxisofthelamppackage. 3. Theopticalaxisiscloselyalignedwiththepackagemechanicalaxis. 4. Thedominantwavelength,ld,isderivedfromtheChromaticityDiagramandrepresentsthecolorofthelamp. 5. LEDlightoutputisbrightenoughtocauseinjuriestotheeyes.PrecautionsmustbetakentopreventlookingdirectlyattheLEDwithunaided eyes.
2
Part Numbering System
HLMP - x x 5x - x x x xx Mechanical Option 00:Bulk DD:AmmoPack ZZ:Flexi-Bin;AmmoPack Color Bin Option 0:FullColorBinDistribution C:ColorBin3&4 Maximum Intensity Bin RefertoDeviceSelectionGuide Minimum Intensity Bin RefertoDeviceSelectionGuide Color B:Blue470nm D:Red630nm M:Green525nm Package H:5mmStandardOval
Note:PleaserefertoAB5337forcompleteinformationaboutpartnumberingsystem.
Absolute Maximum Rating at TA = 25oC
Parameters
DCForwardCurrent[1] PeakPulsedForwardCurrent PowerDissipation LEDJunctionTemperature OperatingTemperatureRange StorageTemperatureRange
Notes: 1. DeratelinearlyasshowninFigures2and7. 2. Dutyfactor10%,frequency1KHz. 3. Dutyfactor30%,frequency1KHz.
Blue and Green
30 100[2] 116 130 -40to+85 -40to+100
Red
50 100[3] 120 130 -40to100 -40to120
Unit
mA mA mW C C C
3
Electrical/Optical Characteristics
TA = 25C Parameters
Forward Voltage Red Green Blue Reverse Voltage Red Green,Blue Capacitance Red Green Blue Thermal Resistance[1] Dominant Wavelength[2,3] Red Green Blue
Symbol
VF VR C RqJ-PIN ld lPEAK Dl1/2 hv jV he
Min.
2.0 2.8 2.8 5.0 5.0 622 520 460
Value Typ.
2.20 3.30 3.20 40 65 64 240 630 525 470 639 516 464 17 32 23 155 520 75 1300 3000 600 30 50 10
Max.
2.40 3.85 3.85
Units
V
Test Condition
IF=20mA
V pF
IR=100A IR=10A VF=0,f=1MHz

634 540 480
C/W nm
LEDJunction-to-Pin IF=20mA
Peak Wavelength Red Green Blue Spectral Half Width Red Green Blue Luminous Efficacy[4] Red Green Blue Luminous Flux Red Green Blue Luminous Efficiency [5] Red Green Blue
nm nm lm/W mlm
PeakofWavelengthofSpectral DistributionatIF=20mA WavelengthWidthatSpectral Distribution1/2PowerPointat IF=20mA EmittedLuminous Power/EmittedRadiantPower
IF=20mA

lm/W
LuminousFlux/ElectricalPower IF=20mA
Notes: 1. ForAlInGaPRed,thethermalresistanceappliedtoLEDjunctiontocathodelead.ForInGaNBlueandGreen,thethermalresistanceappliedto LEDjunctiontoanodelead. 2. Thedominantwavelength,ld,isderivedfromtheChromaticityDiagramandrepresentsthecolorofthelamp. 3. Toleranceforeachcolorbinlimitis0.5nm. 4. Theradiantintensity,Ieinwatts/steradian,maybefoundfromtheequationIe=Iv/hv,whereIvistheluminousintensityincandelasandhvis theluminousefficacyinlumens/watt. 5. he=jV/IFxVF,wherejVistheemittedluminousflux,IFiselectricalforwardcurrentandVFistheforwardvoltage.
4
AlInGaP Red
IF MAX. - MAXIMUM FORWARD CURRENT - mA
60 50 40
30 20 10
0
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE - C
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. ambient temperature.
Figure 3. Forward current vs. forward voltage.
Figure 4. Relative luminous intensity vs. forward current.
InGaN Blue and Green
35
IF - MAXIMUM FORWARD CURRENT - mA
30 25 20 15 10 5 0 0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - C
Figure 5. Relative intensity vs. wavelength.
Figure 6. Forward current vs. forward voltage.
Figure 7. Maximum forward current vs. ambient temperature.
5
Figure 8. Relative intensity vs. forward current.
Figure 9. Relative dominant wavelength vs. DC forward current.
1.0
NORMALIZED INTENSITY
0.5
0
0
30
60
90
120
150
180
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Spatial radiation pattern - major axis.
1.0
NORMALIZED INTENSITY
0.5
0
0
30
60
90
120
150
180
ANGULAR DISPLACEMENT - DEGREES
Figure 11. Spatial radiation pattern - minor axis.
6
Intensity Bin Limit Table
Bin
K L M N P Q R S T U V
Blue Color Bin Table
Bin
1 2 3 4 5
Intensity (mcd) at 20 mA Min Max
310 400 520 680 880 1150 1500 1900 2500 3200 4200 400 520 680 880 1150 1500 1900 2500 3200 4200 5500
Min. Dom
460.0 464.0 468.0 472.0 476.0
Max. Dom
464.0 468.0 472.0 476.0 480.0
Xmin
0.1440 0.1818 0.1374 0.1766 0.1291 0.1699 0.1187 0.1616 0.1063 0.1517
Ymin
0.0297 0.0904 0.0374 0.0966 0.0495 0.1062 0.0671 0.1209 0.0945 0.1423
Xmax
0.1766 0.1374 0.1699 0.1291 0.1616 0.1187 0.1517 0.1063 0.1397 0.0913
Ymax
0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327
Toleranceforeachbinlimitis0.5nm.
Toleranceforeachbinlimitis15%.
Green Color Bin Table
Bin
1 2 3 4 5
Min. Dom
520.0 524.0 528.0 532.0 536.0
Max. Dom
524.0 528.0 532.0 536.0 540.0
Xmin
0.0743 0.1650 0.1060 0.1856 0.1387 0.2068 0.1702 0.2273 0.2003 0.2469
Ymin
0.8338 0.6586 0.8292 0.6556 0.8148 0.6463 0.7965 0.6344 0.7764 0.6213
Xmax
0.1856 0.1060 0.2068 0.1387 0.2273 0.1702 0.2469 0.2003 0.2659 0.2296
Ymax
0.6556 0.8292 0.6463 0.8148 0.6344 0.7965 0.6213 0.7764 0.6070 0.7543
Toleranceforeachbinlimitis0.5nm.
Red Color Range
Min. Dom
622
Max. Dom
634
Xmin
0.6904 0.6726
Ymin
0.3094 0.3106
Xmax
0.6945 0.7135
Ymax
0.2888 0.2865
Toleranceforeachbinlimitis0.5nm.
7
Avago Color Bin on CIE 1931 Diagram
1.000
0.800 Green
1 23 45
0.600 Y 0.400 Red 0.200
5 4 3 2 1
Blue
0.000 0.000
0.100
0.200
0.300
0.400 X
0.500
0.600
0.700
0.800
Relative Light Output vs. Junction Temperature
10
RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25C)
GREEN 1 RED
BLUE
0.1 -40
-20
0
20 40 60 80 TJ - JUNCTION TEMPERATURE - C
100
120
8
Precautions:
Lead Forming:
* TheleadsofanLEDlampmaybepreformedorcutto lengthpriortoinsertionandsolderingonPCboard. * Forbettercontrol,itisrecommendedtouseproper tooltopreciselyformandcuttheleadstoapplicable lengthratherthandoingitmanually. * Ifmanualleadcuttingisnecessary,cuttheleadsafter the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package.Thisishighlyrecommendedforhandsolder operation,astheexcessleadlengthalsoactsassmall heatsink.
Note: 1. PCBwithdifferentsizeanddesign(componentdensity)willhave differentheatmass(heatcapacity).Thismightcauseachangein temperature experienced by the board if same wave soldering settingisused.So,itisrecommendedtore-calibratethesoldering profileagainbeforeloadinganewtypeofPCB. 2. AvagoTechnologies'highbrightnessLEDareusinghighefficiency LEDdiewithsinglewirebondasshownbelow.Customerisadvised to take extra precaution during wave soldering to ensure that themaximumwavetemperaturedoesnotexceed250Candthe solder contact time does not exceeding 3sec. Over-stressing the LEDduringsolderingprocessmightcauseprematurefailuretothe LEDduetodelamination.
Avago Technologies LED configuration
Soldering and Handling:
* CaremustbetakenduringPCBassemblyandsoldering processtopreventdamagetotheLEDcomponent. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closerthan1.59mmmightdamagetheLED.
1.59mm
CATHODE ANODE
AlInGaP Device
InGaN Device
Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand theleadframeisachievedthroughconductivepaste.
* Any alignment fixture that is being applied during wave soldering should be loosely fitted and should notapplyweightorforceonLED.Nonmetalmaterial is recommended as it will absorb less heat during wavesolderingprocess. * Atelevatedtemperature,LEDismoresusceptibleto mechanicalstress.Therefore,PCBmustallowedtocool downtoroomtemperaturepriortohandling,which includesremovalofalignmentfixtureorpallet. * IfPCBboardcontainsboththroughhole(TH)LEDand othersurfacemountcomponents,itisrecommended thatsurfacemountcomponentsbesolderedonthe topsideofthePCB.Ifsurfacemountneedtobeonthe bottom side, these components should be soldered usingreflowsolderingpriortoinsertiontheTHLED. * RecommendedPCboardplatedthroughholes(PTH) sizeforLEDcomponentleads.
LED component lead size Diagonal Plated through hole diameter
* ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damagetotheLEDcomponentthatisESDsensitive. DorefertoAvagoapplicationnoteAN1142fordetails. Thesolderingironusedshouldhavegroundedtipto ensureelectrostaticchargeisproperlygrounded. * Recommendedsolderingcondition:
Wave Soldering [1, 2] Manual Solder Dipping
Pre-heat temperature Preheat time Peak temperature Dwell time
105 C Max. 60 sec Max 250 C Max. 3 sec Max.
260 C Max. 5 sec Max
Note: 1) Above conditions refers to measurement with thermocouple mountedatthebottomofPCB. 2) It is recommended to use only bottom preheaters in order to reducethermalstressexperiencedbyLED.
0.45 x 0.45 mm (0.018x 0.018 inch) 0.50 x 0.50 mm (0.020x 0.020 inch)
0.636 mm (0.025 inch) 0.707 mm (0.028 inch)
0.98 to 1.08 mm (0.039 to 0.043 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch)
* Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensurethatitisalwaysconformingtorecommended solderingconditions. 9
* Over-sizing the PTH can lead to twisted LED after clinching.OntheotherhandundersizingthePTHcan causedifficultyinsertingtheTHLED.
RefertoapplicationnoteAN5334formoreinformationaboutsolderingandhandlingofhighbrightnessTHLEDlamps.
Example of Wave Soldering Temperature Profile for TH LED
TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE
Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux
200
Solder bath temperature: 245C 5C (maximum peak temperature = 250C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.
150
100
50 PREHEAT
0
10
20
30
40
50 60 TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394)
CATHODE
20.5 1.00 (0.8071 0.0394)
9.125 0.625 (0.3593 0.0246) 18.00 0.50 (0.7087 0.0197)
12.70 0.30 (0.50 0.0118) 0.70 0.20 (0.0276 0.0079) ALL DIMENSIONS IN MILLIMETERS (INCHES).
A VIEW A-A
A
4.00 0.20 TYP. (0.1575 0.008)
Note: Theammo-packsdrawingisapplicableforpackagingoption-DD&-ZZandregardlessofstandoffornon-standoff.
10
Packaging Box for Ammo Packs
LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD.
A
+ AN
OD
E
TEC
ANODE LEAD LEAVES THE BOX FIRST.
O AG ES AV LOGI O HN
CA
TH
OD
E
-
C
T MO
HE
RL
AB
EL
Note: ForInGaNdevice,theammopackpackagingboxcontainsESDlogo.
Packaging Label
(i) AvagoMotherLabel:(Availableonpackagingboxofammopackandshippingbox)
(1P) Item: Part Number (1T) Lot: Lot Number LPN (9D) MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID
STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity CAT: Intensity Bin BIN: Refer to below information REV: DeptID:
Made In: Country of Origin
11
(ii)AvagoBabyLabel(Onlyavailableonbulkpackaging)
RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date C/O: Country of Origin Customer P/N: Supplier Code: CAT: Intensity Bin BIN: Refer to below information DATECODE: Date Code QUANTITY: Packing Quantity
Acronyms and Definition:
BIN: (i) ColorbinonlyorVFbinonly (Applicableforpartnumberwithcolorbinsbutwithout VFbinORpartnumberwithVFbinsandnocolorbin) OR (ii)ColorbinincorporatedwithVFBin (Applicable for part number that have both color bin andVFbin)
Example:
(i) ColorbinonlyorVFbinonly BIN:2(representcolorbin2only) BIN:VB(representVFbin"VB"only) (ii)ColorbinincorporatewithVFBin BIN:2VB VB:VFbin"VB" 2:Colorbin2only
DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0305EN AV02-0371EN - July 6, 2007

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